At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview

Tyco Electronics Singapore Pte Ltd (TE Connectivity) is looking for an R&D Scientist/Engineer to join our R&D Center. The Scientist/Engineer will be part of a specialized simulation and modelling team, collaborating with R&D team members, business unit partners as well as local university and government research centers to undertake projects that will embed simulation in TE’s design and process development work flows to deliver a competitive advantage to TE’s technologies. This position is based at our Singapore HQ. 
 

The Singapore R&D Center is chartered to work with the CTO’s of TE’s Business Units to identify technical areas of interest for R&D and develop the technologies that will impact all segments. In order to improve the New Product Development process, TE is expanding the upfront simulation and modelling capabilities, as a part of our Digitalization strategy to improve efficiency, decrease cost and decrease time to market. 

Job Responsibilities

 

Assist with projects to create multi-physical (mechanical, thermal, chemical, electrical etc.) models that target TE product design and manufacturing process needs Evaluate, develop and apply multi-physics solutions using commercial software and cutting-edge numerical methods, as applied to TE problem areas Create awareness across TE of the modelling and simulation capabilities of the Singapore center Work with local and global TE sites, and external customers and vendors, to address urgent or strategic needs  Assist with validation and knowledge transfer of outsourced modelling projects Partner with Singapore research institutes to develop advanced simulation techniques Job Requirements

 

Required:

 

Master or PhD degree in Mechanical Engineering (or related) plus relevant working/research experience  Keen interest in R&D involving simulation, modeling and data Excellent understanding of structural mechanics, heat transfer and MEMS ( Micro Electromechanical Systems) Proven experience with modelling mechanical and thermal problems using FEA simulation packages, preferably with Ansys, Moldex3D, Digimat Proven experience with SpaceClaim, Creo, DesignModeler or similar CAD tools Familiarity with project management

 

Nice to have:

 

Familiarity with some or all of the following: material development and product design Broad knowledge of manufacturing processes (molding, extrusion, plating, stamping, assembly etc.) Familiarity with TE products, such as connector, cable, sensor etc. Broad knowledge of different materials’ mechanical, electric, thermal properties, including polymer, metal and alloy Knowledge of  CFD (computational fluid dynamics) using simulation packages, preferably with Ansys Fluent Knowledge of Signal Integrity and HFSS simulation Knowledge of data science and machine learning Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork