Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include:

Responsible for influencing package and product development by addressing both design and process-driven materials challenges in particular and advancing the technology of semiconductor packaging in general. The scope is to address all materials aspects of packaging technology and associated process and design interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.Responsible for evaluating, qualifying and qualifying advanced packaging materials for development and production and sustaining high material quality for high-yield, efficient productionResponsible for performing lab testing, characterization, and experiment simulating processes and use-condition failuresThis position will interface with package & product design (in particular, thermal and mechanical), reliability testing, failure analysis, assembly R&D and other process teams.

Qualifications

REQUIRED:

Ph.D. in Materials Science and Engineering, or M.S. in Materials Science Engineering plus >3 years of relevant industrial experience, or an advanced degree in a relevant field.Solid knowledge through academic coursework or experience required in Materials Science and Engineering or a relevant major of electronic packaging and related areas.Strong background in material characterization and/or material mechanics with emphasis on failure analysis and design of experiment.Broad knowledge of thermal/mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).

PREFERRED:

Working knowledge in various material testing and characterization instruments.Good understanding of general semiconductor packaging processes, materials, technology and trends, such as molding, wire-bonding, die attach, flip chip, SMT, etc.

Additional Information

 

 

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected].