Primary Duties & Responsibilities

Technology Leadership

Architect and lead R&D projects involving VCSEL-based and SiPh interconnect technologies, with applications in 800G/1.6T transceivers and beyond. Develop novel CPO architectures for high-density AI/ML workloads, focusing on reducing power, latency, and system complexity. Drive the convergence of datacom and AI by co-designing photonics and electronic platforms tailored to edge inference and training clusters.

AI-System Co-Design

Collaborate with AI hardware teams to define interconnect requirements for AI accelerators (GPUs/NPUs). Develop and evaluate low-latency, high-throughput optical links for real-time AI inference, especially for edge and hybrid cloud environments. Leverage ML techniques (e.g., reinforcement learning, neural architecture search) for hardware/system optimization.

Photonic Device & Packaging Innovation

Lead the integration of VCSELs, SiPh modulators, and photonic packaging into scalable system architectures. Investigate next-gen materials and packaging for improved thermal management and photonic-electronic co-integration. Guide reliability assessments and DfX strategies to ensure manufacturability at scale.

Collaboration & Mentorship

Partner with cross-functional teams: signal integrity, firmware, AI system architects, and manufacturing. Mentor junior engineers and guide cross-disciplinary research initiatives. Contribute to technology standardization and IP development (publications, patents, consortium involvement).

Education & Experience

Ph.D. or M.S. in Electrical Engineering, Photonics, Computer Engineering, or related discipline. 5+ years of hands-on experience in datacom photonics, with a strong background in VCSELs, SiPh, or integrated optics.

Skills

Leadership capabilities to xxxx Strong interpersonal, teaming, and problem-solving skills. Work effectively with other members of II-VI A&D xxxxx.

Working Conditions

Expertise in CPO system design, including mechanical, thermal, and optical interface co-optimization. Proven experience in AI hardware or co-design of interconnects for AI compute workloads. Familiarity with relevant standards (IEEE 802.3, OIF, COBO) and simulation tools (Lumerical, HFSS, COMSOL, etc

Physical Requirements

Onsite / hybrid work required

Safety Requirements

All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.

Quality and Environmental Responsibilities

 

Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.

Culture Commitment

Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity – Create an Environment of Trust

Collaboration – Innovate Through the Sharing of Ideas

Accountability – Own the Process and the Outcome

Respect – Recognize the Value in Everyone

Enthusiasm – Find a Sense of Purpose in Work

 

Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

 

 

To conform to U.S. Government export regulations (ITAR), applicant must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8. U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State."