Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

Assist Die Attach / SMT NPI engineers in new process recipe setup, machine conversion, and buy-off for new process development programs.Conduct first-level Root Cause analysis, process inspection for Critical to Quality parameters, and SPC.Support engineering builds, execute DOE/evaluation runs, and compile data and reports.Assist in new material/component first articles inspection, final buyoff, and continuous improvement activities for cost reduction and yield enhancement.Execute Low Volume Manufacturing (LVM) handshake transition with operation process engineering team.Perform other duties as assigned based on scheduled and unscheduled company activities.

Qualifications

REQUIRED:

Technical Diploma in Electrical / Electronic / Mechatronics Engineering or equivalent.  Must be able to work in 12 hours Rotating shift.

PREFERRED:

Min 5 years of process engineering experience preferably in Die Attach process in semiconductor assembly and manufacturing environment.Experience in Thin Die & Multi die stack Die Attach and familiar with Fasford platform will be added advantage.

SKILLS:

Strong proficiently with standard business application Microsoft office, JMP, DOE.A proven desire to work as a team member, both on the same team and outside of the team.Ability to troubleshoot and analyze problems.Ability to multi-task and meet project timeline.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected].