Seoul, Korea, Republic of
53 days ago
Senior OSAT Assembly Manufacturing Operations Manager

NVIDIA is changing the world with its relentless focus on the accelerated computing that has launched the AI revolution. We continue to deliver accelerated computing solutions to ever growing field of applications such Robotics, Autonomous Driving, Genetics, Finance and Professional Visualization. NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 30 years. We provide an incredible mix of uniquely talented people who provide technology solutions that have a lasting impact. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work every day. This is an opportunity to join one of the biggest companies in the world with a unique startup culture that is driving the AI revolution.

NVIDIA Operations team is turbocharging our continuous product volume and revenue growth through speed of light execution and creative supply chain/technology solutions. NVIDIA’s Operations team is looking for a Senior Manager Chip Assembly Manufacturing Operations. We need someone who has a solid technical background, collaborative team spirit as well as an excellent reputation with our manufacturing partners. You will be reporting to Director of IC Supply Chain and Manufacturing.

What You Will Be Doing:

Bring new products and new technologies to high volume manufacturing

Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability

Address manufacturing execution and quality issues through systemic solutions

Deliver datamation solutions for enhanced decision making  

Manage supplier performance evaluation matrix and keep it updated based on changing business needs

Lead change control through qualification and notification

Lead non-conforming material disposition and problem solving

What We Need To See:

Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)

12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging is essential. Photonics packaging experience is a plus

Thorough understanding of chip assembly equipment design --- knowledge of materials, process, substrate/package design in chip assembly operations.

Extensive project management and OSAT management experience

Strong statistical analysis skills – ability to use data visualization techniques to deliver decisions

Deep understanding of quality control, statistics process control, gage R&R and DOE techniques

Knowledge of packaging industry and its supply chain

Excellent written and oral communication skills

 

Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

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