At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview

Leads engineering in the development and start-up of one or more products.

Job Requirements

Responsibilities:

Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged, and Near Package) through the product development cycle. Conducting SI COE analysis, including Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Modeling the connector with the consideration of manufacture impact and application impact. Providing solutions to the SI challenges. This includes identifying the problems, making research plans, developing new technologies, and training and sharing the findings with the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. What your background should look like

Required Skills/Experience:

Bachelor’s degree in Electrical Engineering or equivalent amount of experience. Minimum of 10+ years of work experience in a signal integrity engineering role. Minimum of 8+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR, and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems.  Strong understanding of printed circuit board design, fabrication, and assembly.  Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, Python, C++, VB, etc Excellent presentation, verbal, and written communication skills with an ability to clearly communicate technical concepts to diverse audiences Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies The individual must be highly motivated, a quick learner, and able to work independently

 

 Nice to have Skills/Experience:

Doctor’s degree a PLUS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Signal conditioning techniques (equalization, amplification) Six Sigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies to design, development & manufacturing teams Direct customer design and support experience Design experience with data center compute equipment like servers, switches, routers, storage, antenna, RF front end, or similar systems. Competencies SET : Strategy, Execution, Talent (for managers)