Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Job DescriptionWe are seeking a highly skilled and innovative Principal Engineer, Packaging Engineering to join our team in Batu Kawan, Malaysia. In this pivotal role, you will lead and drive and provide mechanical simulation and solution for Sandisk's SSD development activities while driving innovation and efficiency in our product development processes.
Provide mechanical simulations and solutions for edge-cutting flash memory productsDevelop inhouse structural simulation automation platform based on commercial software's (e.g. ANSYS, Abaqus) Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities Material characterization for simulation accuracy and efficiency improvement Ensure compliance with industry standards and regulations throughout the design and manufacturing process.Lead and mentor a team of packaging engineers, fostering a culture of innovation and continuous improvementWork closely with various business units to understand future product needs and propose solutions.QualificationsRequired
Bachelor's or Master's or PHD Degree in Science or EngineeringExperience Level: Minimum 5 years and above of relevant work experience in packaging engineering, with a proven track record of success in leadership roles.Education background in Mechanical Engineering, Mechanics and Material science, etc.Have a good understanding in solid mechanics, finite element method, material mechanical behaviors.Hands-on experience in mechanical simulations is preferred (SolidWorks/ANSYS/ABAQUS).Preferred
Strong understanding of chip, material, equipment, and package interactions is preferable.Skills
Strong communication and interpersonal skills, with the ability to collaborate effectively across diverse teams.Additional InformationSandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
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