Join Nokia's Advanced Packaging R&D team and be a key player in developing the next generation of high-performance electro-optic modules! As a Mechanical Packaging Engineer, you'll drive the mechanical development of our cutting-edge coherent optical transceivers, integrating Silicon Photonics technology within our Photonic Service Engines. This role offers the opportunity to contribute from initial design concepts all the way through to New Product Introduction, making a significant impact on our innovative products. We invite you to apply and be part of this exciting journey

You have:

Advanced Degree in Mechanical Engineering. 3-5 years of experience in high-volume packaging of 2.5/3D packages.Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software.Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software.Experience with package and process design/development from design to production. Expertise in material properties and yield/failure mode analysis.Experience with documentation of fabrication, inspection, and assembly processes.Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.Expertise in materials property and process, yield analysis and enhancement, failure mode and analysis, Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. Leading Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.Plan and Drive prototype assembly builds to enable deliveries for early design validation.Drive package debug activities during product validation and qualification.Survey new materials and vendors for all Advanced Packaging activities. Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.