Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department IntroductionMicron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability.
Position OverviewAs an HBM Design Engineering Intern, you will contribute to the design, simulation, and optimization of digital and analog circuits for NextGen HBM products. You’ll work with cross-functional teams to translate architectural concepts into manufacturable silicon, applying data-driven methods and automation to improve performance, yield, and time-to-market.
ResponsibilitiesDesign and analyze digital and analog circuits for advanced DRAM/HBMContribute to floorplanning, parasitic modeling, and design validation/tape-out revisionsSimulate and verify designs using tools like FineSim/HSPICE and SystemVerilog/UVMBuild golden models and run corner/Monte Carlo analyses to ensure robust marginsOptimize for power, performance, and area (PPA) using scripting and automationCollaborate with Product Engineering, Test/Probe, Process Integration, Assembly, and MarketingStandardize and automate design checks and flows with CAD and verification teamsExplore new circuit topologies and EDA automation for future memory nodesMinimum QualificationsPursuing a degree in Electrical Engineering or a related fieldStrong foundation in CMOS circuit design and device physicsExperience reading schematics, timing diagrams, and RTLFamiliarity with FineSim and/or HSPICE, SystemVerilog, and scripting languages (Python/Tcl/Perl)Strong analytical problem-solving skills and ability to work in cross-disciplinary teamsPreferred QualificationsFamiliarity with memory design (DRAM/HBM/SRAM) and SoC/IO interfacesExperience with data analysis or scripting to accelerate simulations (e.g., Python with NumPy or Pandas)Interest in EDA automation or applying ML techniques for design optimizationCuriosity about AI’s impact on chip design and emerging toolsClear written and verbal communication skillsAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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