**Job Details:** **Job Description:** We are seeking a highly motivated and technically skilled Foveros Direct Pathfinding Integrator to lead the development and integration of cutting-edge technologies in advanced packaging. The ideal candidate will play a key role in ensuring the successful technology development for future products. Responsibilities included but not limited to the followings: + Lead the TV and Product NPIs, development and baseline data collection activities (for TV and Products) to integrate Foveros Direct next gen stack die on Co-EMIB and monolithic packages. + Lead the Package Design, DOE design and data collection activities that support key technology development areas related to die-package interactions, process flow development and qualification, yield improvement, process spec validation, design rule validation, identify and implement cost effective fab / assembly / substrate solutions that enable a robust die-package process and architecture. + Engage and work closely with key partners such as BU (through MisCos and PDTs), LTD, AFO, product design teams and ATTD stakeholders such as OATD-F, CATD, MTD, ADTS, Automation, xCC, QnR to deliver holistic solutions to the problems. + Develop solutions to problems utilizing statistical knowledge and problem-solving tools. + Achieve timely results by working across organizational boundaries, fostering an inclusive and innovative culture. The ideal candidate should exhibit the following behavioral traits + Strong communication skills, Collaboration. + Innovative thinking. Attention to detail. + Proactive problem-solving. Curiosity and continuous learning. **Qualifications:** You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience. **Minimum skills and experience that will get you noticed:** + Candidate must possess a Bachelor's Degree with 4+ years of relevant experience, **OR** + Master's Degree with 3+ years of relevant experience, **OR** + PhD degree in Engineering with 1+ years of relevant experience. Relevant experience should be in the following: + Process Development: Experience with process control methodologies and statistical analysis tools + Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows. + Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs. **Preferred skills and experience that will make you stand out** : + Focus on fundamental understanding of advanced packaging process development (Foveros/DOW processes, EMIB based assembly process or Foveros Direct/Hybrid Bonding processes). + Knowledge of WLA NPI methodology, DOE and statistical Process control. + Knowledge of characterization techniques such as CSAM, Xray, XPS, FTIR, SEM, EDX. + Experience in package design, assembly process interaction is a plus. **Job Type:** Experienced Hire **Shift:** Shift 1 (United States of America) **Primary Location:** US, Oregon, Hillsboro **Additional Locations:** US, Arizona, Phoenix **Business group:** Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from multi-node semiconductor process development and global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. **Posting Statement:** All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. **Position of Trust** N/A **Benefits:** We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003 Annual Salary Range for jobs which could be performed in the US: $153,540.00-$216,770.00 **S** **al** **ary** **range** **dependent on a number of factors including location and experience.** **Work Model for this Role** This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.