Seremban, MYS
56 days ago
ENGR PRIN, PACKAGE DEVELOPMENT
**KEY RESPONSIBILITIES** • This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and process for early engagement in package development and qualification for a robust HVM. • Analyze and implement efficient, cost effective and innovative methodologies to improve assembly processes. • Good knowledge in Six Sigma methodology and the DMAIC approach. • Experienced in running the Design of Experiment (DOE) and analyzing data using JMP software. • Practice good quality system and production control. • Good teamwork and leadership. **KNOWLEDGE, SKILLS AND ABILITIES** • Must be statistically sound and familiar in running DOE, perform characterization and optimization studies independently. Familiar with JMP/ minitab software is an advantage. • Proficient in Malay and English. **onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. **More details about our company benefits can be found here:** https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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