For our client, a global leader in semiconductor R&D, we are seeking a Director of Advanced 3DIC & STCO R&D Programs to lead strategic innovation initiatives in 3D integrated circuits and system-technology co-optimization. Based in Belgium Leuven, this high-impact role offers the opportunity to shape next-generation semiconductor technologies in collaboration with top-tier global partners.

This role is a unique opportunity for a senior expert to lead next-generation R&D initiatives in 3D Integrated Circuits (3DIC) and System-Technology Co-Optimization (STCO), influencing both corporate strategy and global technology development.

You will operate from a world-class European research hub in Leuven, collaborating with international stakeholders across academia, industry, and internal R&D units.
Responsibilities

    Lead internal and external R&D programs focused on 3DIC and STCO technologies.

    Evaluate emerging trends through literature reviews, technology scouting, and simulation studies.

    Define long-term technology roadmaps and strategic innovation priorities.

    Deliver high-impact technical reports and recommendations to senior leadership.

    Develop and maintain collaborative partnerships with universities, suppliers, and research consortia.

    Guide prototyping activities to validate new integration and architecture concepts.

    Influence cross-functional product and platform strategies through technical leadership.

    Organize internal technical workshops and maintain active engagement with global innovation ecosystems.

    Represent the company at international conferences and technical forums.

Required Skills & Qualifications

    PhD in Electrical Engineering, Microelectronics, Applied Physics, or related field.

    5+ years of post-PhD experience in semiconductor R&D, either in academia or industry.

    Deep expertise in one or more of the following areas:

        3DIC architecture and design

        Physical design and advanced packaging

        STCO for power, interconnect, or thermal solutions

        Heterogeneous integration (e.g. AI, mobile, computing)

        Power and signal integrity in advanced chip systems

    Strong strategic thinking combined with hands-on technical analysis skills.

    Proven experience in leading cross-functional or international research initiatives.

    Excellent communication and stakeholder management skills.

    Proficient in English (spoken and written).

    Skilled in presenting complex ideas clearly using tools like PowerPoint and Excel.

    Willingness to travel occasionally across Europe and internationally.

Why Apply?

This is a rare opportunity to join a high-impact innovation program at the core of one of the most advanced areas of semiconductor technology. As Director, you will:

    Shape the future of 3DIC design and integration.

    Collaborate with world-leading experts and institutions.

    Influence corporate and product-level strategies.

    Work in an agile and globally connected R&D environment.

    Be part of a mission to drive breakthroughs in computing, AI, and next-gen electronics.

Contact
Philippe BILDÉ
Antal International Paris London
[email protected]
www.antal.com/recruitment/france-paris-bsc