**Summary:** Meta is looking for an experienced ASIC Packaging Engineer, Signal Integrity, and Power Integrity focus for its ASIC packaging team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team. **Required Skills:** ASIC Package Engineer Responsibilities: 1. Drive chip-package-system co-design optimization for High Performance Computing using 2.5D/3D package technology 2. Lead development and roadmap creation for advanced and disruptive packaging technologies (SMT, solder ball attach, assembly processes) for AI/ML and networking products 3. Influence and align ASIC vendors, foundry, and OSAT partners' roadmaps with Meta ASICs roadmap 4. Perform package design and feasibility studies for AI/ML and networking applications including single-chip, multi-chip, and SiP/module packaging 5. Collaborate cross-functionally with internal teams (Si, architecture, system) and external partners (ODM, design houses, OSATs) to ensure manufacturability and integration 6. Conduct design analysis and what-if scenarios for novel packaging schemes to improve package form factor 7. Create and analyze Design of Experiments (DOE) for development and sustaining activities 8. Stay updated on advanced packaging technologies and market trends, identifying emerging technologies for future applications 9. Capacity to travel internationally, typically once per quarter 10. Ability to define package requirements and collaborate with multi-functional teams 11. Leadership in package development to ensure manufacturability and reliability **Minimum Qualifications:** Minimum Qualifications: 12. 8+ years of experience in advanced packaging, including surface mount technology, assembly process development, and manufacturing 13. Demonstrated experience of flip chip, 2.5D, and 3D packaging technologies 14. Proven experience taking products from concept to production, including manufacturing specifications, vendor qualifications, and cost/efficiency improvements 15. Experience of cross-functional collaboration skills with internal teams and external partners (silicon, architecture, system, ASIC design, foundry, OSAT, substrate vendors) 16. Experience in silicon architecture/package/PCB/system co-design to develop optimal solutions **Preferred Qualifications:** Preferred Qualifications: 17. Advanced degree (Master's or PhD) in Materials Science, Mechanical Engineering, or related field 18. 10+ years of experience in advanced packaging assembly processes, including SMT 19. Demonstrated experience of 2.5D and 3D packaging technologies, including silicon interposers, TSVs, microbumps, and fanout advanced packaging 20. Experience collaborating with ODM, assembly packaging, OSAT, and foundry partners 21. Technical understanding of semiconductor packaging materials, material interactions, SMT processes, PCB design/layout, failure mechanisms, and analytical techniques 22. Familiarity with Finite Element Modeling (FEM) for thermal and thermo-mechanical package behavior 23. Knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI) 24. Understanding of package qualification, reliability methods, and failure analysis **Public Compensation:** $173,000/year to $249,000/year + bonus + equity + benefits **Industry:** Internet **Equal Opportunity:** Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment. Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@fb.com.